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Electronic packaging Congresses (Topical Term)

Preferred form: Electronic packaging Congresses

Machine generated authority record.

Work cat.: (OSt)3144: International Symposium onCeramic Substrates and Packages ( 1987 : Denver, Colo.) 2344, Ceramic substrates and packages for electronic applications, c1989

    Thailand Institute of Scientific and Technological Research
    35 Mu 3 Technopolis, Tambon Khlong Ha, Amphoe Khlong Luang, Pathum Thani 12120
    ☎ 0 2577 9000, 0 2577 9300